Samsung Electronics has presented its first 14-nm test chip FinFET. These chips are the second mass-market chips after Intel, received their own implementation of a three-dimensional “sandwich” structure-based 3D-transistors, these transistors Tri-Gate, designed for the new Intel chips Ivy Bridge. Samsung says that the new chips are created in collaboration with ARM and Synopsis.
According to engineers at Samsung, the new chips support the placement of components in multiple layers and to boost performance while maintaining consumption and physical size of the processor.
ARM said that the development of FinFET started some 10 years ago, long before Intel announced its technology Tri-Gate. This Technology can be placed on the same physical size of the chip with much more smaller transistors which allows increase in processing power.